IPC J-STD-005 Requirements for Soldering Pastes

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IPC J-STD-005 Document Information:

Title
Requirements for Soldering Pastes

IPC-Association Connecting Electronics Industries

Publication Date:
Jan 1, 1995

Scope:

This standard prescribes general requirements for the characterization and testing of solder pastes used to make high quality electronic interconnections. This specification is a quality control document and is not intended to relate directly to the material's performance in the manufacturing process.

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