IPC TM-650 2.4.41.2 Coefficient of Thermal Expansion-Strain Gage Method

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IPC TM-650 2.4.41.2 Document Information:

Title
Coefficient of Thermal Expansion-Strain Gage Method

IPC-Association Connecting Electronics Industries

Publication Date:
May 1, 2004

Scope:

To describe the strain gage method for determining linear thermal expansion of laminated materials within the temperature range of −55 °C to +130 °C and inorganic substrates (nonlaminated) with a range of −55 °C to +150 °C.

Care should be taken if the higher temperatures are used. The adhesive shown is rated by the manufacturer from less than −200 °C to greater than +300 °C; however, for higher temperature pretesting with the Titanium Silicate Standard or materials of known thermal expansion characteristics is recommended.

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