IPC TM-650 2.3.17.2 Resin Flow of "No Flow" Prepreg
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IPC TM-650 2.3.17.2 Document Information:
Title
Resin Flow of "No Flow" Prepreg
IPC-Association Connecting Electronics Industries
Publication Date:
Aug 1, 1997
Scope:
This test method is designed to measure the Resin Flow of "no flow"
prepreg used for bonding and adhesion without formation of resin bead as
caused by flow of the resin.
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