IPC TM-650 2.4.28.1 Solder Mask Adhesion - Tape Test Method
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IPC TM-650 2.4.28.1 Document Information:
Title
Solder Mask Adhesion - Tape Test Method
IPC-Association Connecting Electronics Industries
Publication Date:
Mar 1, 2007
Scope:
This test method defines the procedure for determining the
adhesion of solder resists (masks) used over melting metals, (such
as solder plated and reflowed solder printed boards both prior to
and after soldering), nonmelting metals, and printed board
substrates.
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